Updated : Oct 11, 2019 in Personal Growth

IPC JEDEC J-STD-033B.1 PDF

Supersedes IPC/JEDEC J-STD .. Mass Reflow This standard applies to bulk solder reflow assembly by convection, convection/IR. Joint IPC/JEDEC Standard J-STD Page 1. STANDARD FOR HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW. SENSITIVE SURFACE. J-STDD. – Published August – Typos corrected 3/08 (Rev D.1). • J- STD – Published August • J-STDC. – Balloted within JEDEC & IPC.

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Other jeded schemes may be used. When dry packing, the desiccant shall be removed from the storage container just prior to placing it into the MBB and sealing the MBB.

Standards & Documents Search | JEDEC

k-std-033b.1 For j-st-d033b.1 sensitivity, moisture from atmospheric humidity enters permeable packaging materials by diffusion. Table lists equivalent derated? Any copying, scanning or other reproduction of these materials without the prior written consent of the copyright holder is strictly prohibited and constitutes infringement under the Copyright Law of the United States.

This method will minimize moisture related component damage. If more than three are required for any reason, the supplier should be consulted reference J-STD Marty Rodriguez, Jabil Circuit, Inc.

HIC Testing Method To function properly, the spots must show a visually perceptible color change to indicate a change in the amount of humidity. Acceptable safe storage conditions for SMD packages classi? The cards inside the chamber must be observable from outside the chamber.

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It is intended to make the HIC test method and criteria a separate standard in the future. The percentage of change in hue from one humidity value to another is then calculated. Icp bags should be inspected to verify there are no holes, gouges, tears, punctures, or openings of any kind that would expose either the contents or an inner layer of a multilayer bag. Amol Kirtikar, Sud-Chemie Inc. Heidi Reynolds, Oracle America, Inc.

Also the actual bake time may be reduced if technically justi?

J-STDC操作.包装.出货及湿敏表面安装设备的使用_百度文库

Individuals or companies are invited to submit comments to IPC. A dry cabinet should not be considered a MBB.

If one hour exposure is exceeded, refer to Clause 4. The bags shall be heat sealable.

Therefore, the effect of these materials must be compensated for by baking jjedec, if required, adding additional desiccant in the MBB to ensure the shelf life of the SMD packages.

A representative dry-pack con?

Standards & Documents Search

When identifying a bake cycle, the maximum exposure temperature and maximum rate of temperature change of components and materials on the subject printed wiring assembly must be considered, and an appropriate time temperature pro?

Any SMD package that has not exceeded its? Although unanticipated, factors other than moisture sensitivity could affect the total shelf life of components. If the time limit is exceeded the packages should be baked according to Table to restore the?

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If bake is interrupted for greater than 15 minutes the total time of the interruption should be added to the bake time. With component and board temperature restrictions hedec mind, choose a bake temperature from Table ; then determine the appropriate bake duration based on the component to be removed.

Existence of such Standards and Publications shall not in any respect preclude any member or nonmember of JEDEC or IPC from manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by those other than JEDEC and IPC members, whether the standard is to be used either domestically or internationally.

Paper and Plastic Container Items Any standard involving a complex technology draws material from a vast number of sources.

Although the body temperature during re? Water clean processes after the? Temperatures on neighboring SMD packages above the melting point of the solder being used may cause some solder joints to partially re? Users are also wholly responsible for protecting themselves against all claims of liabilities for patent infringement.